Technologies for the fabrication of cylindrical fine line devices

Risultato della ricerca: Articlepeer review

4 Citazioni (Scopus)

Abstract

A microlithographic process suited for metal patterning on cylindrical dielectric substrates has been developed. This includes all steps from metal coating to final etching, with resolution in the 5 μm range.
Lingua originaleEnglish
pagine (da-a)417-420
Numero di pagine4
RivistaMicroelectronic Engineering
Volume35
Stato di pubblicazionePublished - 1997

All Science Journal Classification (ASJC) codes

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  • ???subjectarea.asjc.3100.3107???
  • ???subjectarea.asjc.3100.3104???
  • ???subjectarea.asjc.2500.2508???
  • ???subjectarea.asjc.2200.2208???

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