Abstract
A microlithographic process suited for metal patterning on cylindrical dielectric substrates has been developed. This includes all steps from metal coating to final etching, with resolution in the 5 μm range.
Lingua originale | English |
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pagine (da-a) | 417-420 |
Numero di pagine | 4 |
Rivista | Microelectronic Engineering |
Volume | 35 |
Stato di pubblicazione | Published - 1997 |
All Science Journal Classification (ASJC) codes
- ???subjectarea.asjc.2500.2504???
- ???subjectarea.asjc.3100.3107???
- ???subjectarea.asjc.3100.3104???
- ???subjectarea.asjc.2500.2508???
- ???subjectarea.asjc.2200.2208???