Resist Coating of Cylindrical Samples for 3-D Lithography

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A quantitative investigation of a dipping technique for depositing a thin layer of resist on circularly symmetrical objects is presented. The results obtained are valuable for preparing three-dimensional (3-D) surfaces suited for spatial microlithographic processes in the 1 to 10 μm linewidth range. © 1995, MCB UP Limited
Lingua originaleEnglish
pagine (da-a)22-24
Numero di pagine3
RivistaMicroelectronics International
Stato di pubblicazionePublished - 1995

All Science Journal Classification (ASJC) codes

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  • ???subjectarea.asjc.3100.3107???
  • ???subjectarea.asjc.3100.3104???
  • ???subjectarea.asjc.2500.2508???
  • ???subjectarea.asjc.2200.2208???


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