Numerical Analysis of Piezoelectric Active epair in the Presence of Frictional Contact Conditions

Alberto Milazzo, Calogero Orlando, Andrea Alaimo, Antonio Messineo

Risultato della ricerca: Articlepeer review

8 Citazioni (Scopus)


The increasing development of smart materials, such as piezoelectric and shapememory alloys, has opened new opportunities for improving repair techniques. Particularly,active repairs, based on the converse piezoelectric effect, can increase the life of a structureby reducing the crack opening. A deep characterization of the electromechanical behavior ofdelaminated composite structures, actively repaired by piezoelectric patches, can be achievedby considering the adhesive layer between the host structure and the repair and by takinginto account the frictional contact between the crack surfaces. In this paper, BoundaryElement (BE) analyses performed on delaminated composite structures repaired by activepiezoelectric patches are presented. A two-dimensional boundary integral formulation forpiezoelectric solids based on the multi-domain technique to model the composite hostdamaged structures and the bonded piezoelectric patches is employed. An interface springmodel is also implemented to take into account the finite stiffness of the bonding layers andto model the frictional contact between the delamination surfaces, by means of an iterativeprocedure. The effect of the adhesive between the plies of piezoelectric bimorph devices onthe electromechanical response is first pointed out for both sensing and actuating behavior.Then, the effect of the frictional contact condition on the fracture mechanics behavior ofactively repaired delaminated composite structures is investigated.
Lingua originaleEnglish
pagine (da-a)4390-4403
Numero di pagine14
Stato di pubblicazionePublished - 2013

All Science Journal Classification (ASJC) codes

  • ???subjectarea.asjc.1600.1602???
  • ???subjectarea.asjc.1300.1303???
  • ???subjectarea.asjc.3100.3107???
  • ???subjectarea.asjc.3100.3105???
  • ???subjectarea.asjc.2200.2208???


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