Abstract
We propose the electromechanical impedance (EMI) technique to assess the stability of dental implants. The technique consists of bonding a piezoelectric transducer to the element to be monitored. Conventionally, electromechanical admittance is used to diagnose structural damage. In this study, we created a 3D finite element model to mimic a transducer bonded to the abutment of a dental implant placed in a host bone site. We simulated the healing after surgery by changing the Young's modulus of the bone-implant interface. The results show that as the Young's modulus of the interface increases, the electromechanical characteristic of the transducer changes.
Lingua originale | English |
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pagine (da-a) | 128-134 |
Numero di pagine | 7 |
Rivista | Procedia Engineering |
Volume | 109 |
Stato di pubblicazione | Published - 2015 |
All Science Journal Classification (ASJC) codes
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