We propose the electromechanical impedance (EMI) technique to assess the stability of dental implants. The technique consists of bonding a piezoelectric transducer to the element to be monitored. Conventionally, electromechanical admittance is used to diagnose structural damage. In this study, we created a 3D finite element model to mimic a transducer bonded to the abutment of a dental implant placed in a host bone site. We simulated the healing after surgery by changing the Young's modulus of the bone-implant interface. The results show that as the Young's modulus of the interface increases, the electromechanical characteristic of the transducer changes.
|Numero di pagine||7|
|Stato di pubblicazione||Published - 2015|
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