Microcracking in piezoelectric materials by the Boundary Element Method

Risultato della ricerca: Conference contribution


A 3D boundary element model for piezoelectric polycrystalline micro-cracking is discussed in this contribution. The model is based on the boundary integral representation of the electro-mechanical behavior of individual grains and on the use of a generalized cohesive formulation for inter-granular micro-cracking. The boundary integral formulation allows to address the electro-mechanical boundary value problem in terms of generalized grain boundary and inter-granular displacements and tractions only, which implies the natural inclusion of the cohesive laws in the formulation, the simplification of the analysis pre-processing stage, and the reduction of the number of degrees of freedom of the overall analysis with respect to other popular numerical methods.
Lingua originaleEnglish
Titolo della pubblicazione ospiteAdvances in Boundary Element and Meshless Techniques
Numero di pagine6
Stato di pubblicazionePublished - 2019


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