Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays

Claudio Arnone, Marco Barbera, Giuseppe Lullo, Lo Cicero, Barbera, Collura

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2 Citazioni (Scopus)

Abstract

We are developing a method to build arrays of Ge-based microcalorimeters for soft X-rays detection using micro-photolithographic techniques. A key element of the process is the electrical and thermal connection between the germanium sensors and the interconnection electrical tracks, that lay on a substrate acting as mechanical support and thermal sink. The geometry of the sensors, that have a square base truncated pyramid shape, makes feasible a connection through indium soldering. We describe a technique, based on microlithography and electroplating, adopted to grow indium bumps of a few tens of square microns of area and several microns high on top of the contact pads patterned on the substrate. The sensor array is placed over the bumps and a subsequent baking melts the indium, soldering the sensors to the pads.
Lingua originaleEnglish
pagine (da-a)535-540
Numero di pagine6
RivistaJournal of Low Temperature Physics
Volume167
Stato di pubblicazionePublished - 2012

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All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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