Abstract
We are developing a method to build arrays of Ge-based microcalorimeters for soft X-rays detection using micro-photolithographic techniques. A key element of the process is the electrical and thermal connection between the germanium sensors and the interconnection electrical tracks, that lay on a substrate acting as mechanical support and thermal sink. The geometry of the sensors, that have a square base truncated pyramid shape, makes feasible a connection through indium soldering. We describe a technique, based on microlithography and electroplating, adopted to grow indium bumps of a few tens of square microns of area and several microns high on top of the contact pads patterned on the substrate. The sensor array is placed over the bumps and a subsequent baking melts the indium, soldering the sensors to the pads.
Lingua originale | English |
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pagine (da-a) | 535-540 |
Numero di pagine | 6 |
Rivista | Journal of Low Temperature Physics |
Volume | 167 |
Stato di pubblicazione | Published - 2012 |
All Science Journal Classification (ASJC) codes
- ???subjectarea.asjc.3100.3107???
- ???subjectarea.asjc.2500.2500???
- ???subjectarea.asjc.3100.3104???