Controlled solution-based fabrication of perovskite thin films directly on conductive substrate

Risultato della ricerca: Articlepeer review

Abstract

Organometallic perovskites are one of the most investigated materials for high-efficiency thin-film devices to convert solar energy and supply energy. In particular, methylammonium lead iodide has been used to realize thin-film perovskite solar cells, achieving an efficiency higher than 20%. Different fabrication procedures based on the spin-coating technique have been proposed, which do not ensure homogenous morphologies. In this work, we present a scalable process to fabricate methylammonium lead iodide thin films directly on conductive substrates, consisting of electrodeposition and two subsequent chemical conversions. A thorough investigation of the morphological, structural and compositional properties of the layer is performed after each fabrication step. It is demonstrated that this method allows fine control of the thickness of the layer by tuning the cell parameters during the electrodeposition step. X-ray diffraction patterns and energy-dispersive X-ray analysis indicate the achievement of high-purity methylammonium lead iodide layers. Micro-Raman analyses were used to demonstrate the formation of methylammonium lead iodide. Finally, ultraviolet-visible absorption spectra were acquired to determine the optical band edge of the layer (̴ 1.56 eV) and the absorbance of methylammonium lead iodide as a function of the film thickness. As expected, the material exploits excellent optical properties, achieving an absorption ≥ 99.9% in the entire visible range for a layer thickness of 1.3 µm. The results presented here pave the way for the application of cost-friendly solution-based processes to fabricate high-quality perovskite solar cells.
Lingua originaleEnglish
Numero di pagine9
RivistaThin Solid Films
Volume733
Stato di pubblicazionePublished - 2021

All Science Journal Classification (ASJC) codes

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  • ???subjectarea.asjc.3100.3110???
  • ???subjectarea.asjc.2500.2508???
  • ???subjectarea.asjc.2500.2505???
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