Boundary elements analysis of adhesively bonded piezoelectric active repair

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18 Citazioni (Scopus)

Abstract

This paper presents the analysis of active piezoelectric patches for cracked structures by theBoundary Element Method. A two dimensional boundary integral formulation based on the multidomaintechnique is used to model cracks and to assemble the multi-layered piezoelectric patches to the hostdamaged structures. The fracture mechanics behavior of the repaired structures is analyzed for both perfectand imperfect interface between patches and host beams. The imperfect interface, representing theadhesive between two different layers, is modeled by using a "Spring Model" that involves linearrelationships between the interface tractions, in normal and tangential directions, and the respectivediscontinuity in displacements. Numerical analyses performed on a cracked cantilever beam repaired bysingle and multilayered patches are presented. It is pointed out that the adhesive deeply influences theperformances of the repair as highlighted by an increasing of the repairing voltage values with respect toperfect bonding case.
Lingua originaleEnglish
pagine (da-a)500-511
Numero di pagine12
RivistaEngineering Fracture Mechanics
Volume76
Stato di pubblicazionePublished - 2009

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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