In this article, a review of the existing special bonding techniques for medium voltage and high-voltage cables is presented. Special bonding techniques have the purpose of reducing sheath currents, thereby limiting copper losses and the reduction of the ampacity of cables. The literature review shows various bonding techniques and how these have evolved over the years thanks to new technologies. Simulations of each technique are performed in MATLAB/Simulink, to compare their strengths and drawbacks both under normal conditions and in the presence of a single-line-to-ground fault.
|Numero di pagine||9|
|Rivista||IEEE Transactions on Industry Applications|
|Stato di pubblicazione||Published - 2021|
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